Warren Macaraig

Senior Process & Technology Specialist with 17+ years in IC substrate, PCB, and advanced packaging,  @including FOPLP, MIS-BGA, MIS-QFN, and Embedded Component Packaging. Proven track record in  @yield improvement, technology integration, NPI, and DOE-driven optimization. Strong expertise in  @Solder Resist, Dry Film, Layer Build-Up, and Lithography. Extensive hands-on work in R&D, factory  @ramp-up, equipment qualification, and customer interface. Skilled in SPC, FMEA, FA, JMP, 8D, and model based problem-solving techniques.

Senior Process & Technology Specialist with 17+ years in IC substrate, PCB, and advanced packaging, 
including FOPLP, MIS-BGA, MIS-QFN, and Embedded Component Packaging. Proven track record in 
yield improvement, technology integration, NPI, and DOE-driven optimization. Strong expertise in 
Solder Resist, Dry Film, Layer Build-Up, and Lithography. Extensive hands-on work in R&D, factory 
ramp-up, equipment qualification, and customer interface. Skilled in SPC, FMEA, FA, JMP, 8D, and  model based problem-solving techniques.

BS Electronics Engineering